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Advanced Packaging Material: Wafer Protection Film

Application process reduce quality performance
Wafer Protection Film
●Application for WLCSP & Fan-Out process, can reduce the defects caused by cutting the wafer.
●Excellent laser marking quality.
●Excellent adhesion performance with metal .
●Excellent heat dissipation.
●Application for Infrared (IR) Transmission inspection of wafer backside.
●Control wafer warpage for RDL process.
●Can Customize film feature i.e. magnetic, transparent...etc.
●Eco-friendly, do not contain toluene
Width:
  • 220mm for 8” Wafer
  • 330mm for 12” Wafer
  • 500~680mm for Panel Size
  • Customized Size

Thickness:
20 ~ 200 um
Applications:
SiP, WLP, WLCSP, Flipchip, Stacked die, Fan-out, Fan-in, 3D IC
https://www.applichem.com.tw/news-detail-2847775.html
#Application  #process  #reduce  #quality  #performance 
分類:科技

晶化科技2015年斥資9,000萬元,在竹南科學園區設立生產工廠,主要供應半導體封裝材料及關鍵原物料,晶化科技經過五年多來的專研與開發,打破了半導體封裝材料市場長期被日本廠商壟斷的局面,半導體封裝材料陸續通過客戶認證,預計今年營收可望持續成長並成為台灣國產封裝材料的代表供應廠商。

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