Wafer Protection Film
●Application for WLCSP & Fan-Out process, can reduce the defects caused by cutting the wafer.
●Excellent laser marking quality.
●Excellent adhesion performance with metal .
●Excellent heat dissipation.
●Application for Infrared (IR) Transmission inspection of wafer backside.
●Control wafer warpage for RDL process.
●Can Customize film feature i.e. magnetic, transparent...etc.
●Eco-friendly, do not contain toluene
- 220mm for 8” Wafer
- 330mm for 12” Wafer
- 500~680mm for Panel Size
- Customized Size
20 ~ 200 um
SiP, WLP, WLCSP, Flipchip, Stacked die, Fan-out, Fan-in, 3D IC