分享

Advanced Packaging Material: Wafer Warpage Control Film

control process quality performance metal
Wafer Warpage Control Film
●Can control any wafer warpage for RDL process.
●Excellent laser marking quality.
●Excellent adhesion performance with metal .
●Excellent heat dissipation.
●Application for Infrared (IR) Transmission inspection of wafer backside.
●Can Customize film feature i.e. magnetic, transparent...etc.
●Eco-friendly, do not contain toluene
Width:
  • 220mm for 8” Wafer
  • 330mm for 12” Wafer
  • 500~680mm for Panel Size
  • Customized Size

Thickness:
20 ~ 200 um
Applications:
Fan-Out, Fan-In, WLCSP, SiP, 3D IC packaging
https://www.applichem.com.tw/news-detail-2847784.html
#control  #process  #quality  #performance  #metal 
分類:科技

晶化科技2015年斥資9,000萬元,在竹南科學園區設立生產工廠,主要供應半導體封裝材料及關鍵原物料,晶化科技經過五年多來的專研與開發,打破了半導體封裝材料市場長期被日本廠商壟斷的局面,半導體封裝材料陸續通過客戶認證,預計今年營收可望持續成長並成為台灣國產封裝材料的代表供應廠商。

評論
上一篇
  • Advanced Packaging Material: Wafer Protection Film
  • 下一篇
  • Advanced Packaging Material: WaferChem Build-Up Film
  • 更多文章
    載入中... 沒有更多了