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Advanced Packaging Material: WaferChem Build-Up Film

research search build replace traditional
WaferChem Build-Up Film
●Independent research and manufacure in Taiwan
● copper can chemical plating on the build-Up film which can replace traditional copper foil substrate.
●can reduce the thickness of substrate, solve the difficulty of laser drilling on BT substrate.
●Excellent adhensive performance, chemical resistance and grinding material.
●Low CTE to reduce package warpage
●Low Dk & Df
●Preservation condition (0-5 degreeC  6 Months )
●Eco-friendly, do not contain toluene
Width:
  • 220mm for 8” Wafer
  • 330mm for 12” Wafer
  • 500~680mm for Panel Size
  • Customized Size

Thickness:
20 ~ 200 um
Applications:
IC interlayer dielectric material, coreless substrate, 5G product
https://www.applichem.com.tw/news-detail-2847787.html
#research  #search  #build  #replace  #traditional 
分類:科技

晶化科技2015年斥資9,000萬元,在竹南科學園區設立生產工廠,主要供應半導體封裝材料及關鍵原物料,晶化科技經過五年多來的專研與開發,打破了半導體封裝材料市場長期被日本廠商壟斷的局面,半導體封裝材料陸續通過客戶認證,預計今年營收可望持續成長並成為台灣國產封裝材料的代表供應廠商。

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