●Independent research and manufacure in Taiwan
● copper can chemical plating on the build-Up film which can replace traditional copper foil substrate.
●can reduce the thickness of substrate, solve the difficulty of laser drilling on BT substrate.
●Excellent adhensive performance, chemical resistance and grinding material.
●Low CTE to reduce package warpage
●Low Dk & Df
●Preservation condition (0-5 degreeC 6 Months )
●Eco-friendly, do not contain toluene
- 220mm for 8” Wafer
- 330mm for 12” Wafer
- 500~680mm for Panel Size
- Customized Size
20 ~ 200 um
IC interlayer dielectric material, coreless substrate, 5G product