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Advanced Packaging Material:Transparent Molding Film

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Transparent Molding Film  
●Independent research and manufacure in Taiwan
● Transparent feature let 3D IC packaging stack and align easily.
●Excellent adhensive performance, chemical resistance and grinding material.
●Excellent gap filling ability, protect device from moisture damage.
●Low CTE and no die-shift.
●Low Dk & Df.
●Eco-friendly, do not contain toluene.
Product Structure:
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Width:
  • 220mm for 8” Wafer
  • 330mm for 12” Wafer
  • 500~680mm for Panel Size
  • Customized Size

Thickness:
20 ~ 200 um
Applications:
Fan-Out, Fan-In, WLCSP, SiP, 3D IC packaging
Mini/Micro LED packaging (Effective protection of LED chip and prevent falling off)
https://www.applichem.com.tw/news-detail-2847789.html
#parent  #research  #search  #feature  #performance 
分類:藝文

晶化科技2015年斥資9,000萬元,在竹南科學園區設立生產工廠,主要供應半導體封裝材料及關鍵原物料,晶化科技經過五年多來的專研與開發,打破了半導體封裝材料市場長期被日本廠商壟斷的局面,半導體封裝材料陸續通過客戶認證,預計今年營收可望持續成長並成為台灣國產封裝材料的代表供應廠商。

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