分享

Taiwan Build-Up film for ABF substrate


Taiwan Build-Up Film
● Independent research and manufacure in Taiwan
● Copper can chemical plating on the build-Up film which can replace traditional copper foil substrate.
● Can reduce the thickness of substrate, solve the difficulty of laser drilling on BT substrate.
● Excellent adhensive performance, chemical resistance and grinding material.
● Low CTE to reduce package warpage
● Low Dk & Df
● Preservation condition better than Japan Brand  (0-5 degreeC  6 Months )
● Eco-friendly, do not contain toluene
Product Structure:
Taiwan Build-Up Film Process Flow
Width:
  • 220mm for 8” Wafer
  • 330mm for 12” Wafer
  • 500~680mm for Panel Size
  • Customized Size

Thickness:
20 ~ 200 um
Applications:
IC interlayer dielectric material, coreless substrate, 5G product, ABF substrate
https://www.waferchem.com.tw/taiwan-build-up-film-en.html
https://www.applichem.com.tw/news-detail-3086509.html
分類:科技

晶化科技2015年斥資9,000萬元,在竹南科學園區設立生產工廠,主要供應半導體封裝材料及關鍵原物料,晶化科技經過五年多來的專研與開發,打破了半導體封裝材料市場長期被日本廠商壟斷的局面,半導體封裝材料陸續通過客戶認證,預計今年營收可望持續成長並成為台灣國產封裝材料的代表供應廠商。

評論
上一篇
  • 半導體異質整合發展,台灣兩大龍頭齊聲需藉產業鏈合作
  • 下一篇
  • 半導體先進製程新商機 國產材料廠搶卡位
  • 更多文章
    載入中... 沒有更多了